The semiconductor industry manufactures a very huge variety of
integrated circuits that have different packaging requirements.
Package attributes that are taken into consideration when choosing a
package type for a particular semiconductor device include: size, lead
count, power dissipation, field operating conditions, and of course,
cost.
Popular IC package types used in the semiconductor industry today are
presented in
Table 1 below.
Table 1. Types of IC
Packages (not shown in scale)
|
 |
CBGA
- Ceramic Ball Grid Array |
 |
CCGA
- Ceramic Column Grid Array
|
 |
CerDIP
- Ceramic Dual-in-Line Package
|
 |
CerPack
- Ceramic Package |
 |
CLCC
- Ceramic Leadless Chip Carrier |
|
 |
CPGA - Ceramic
Pin Grid
Array |
|
 |
CQFP - Ceramic Quad Flat Pack |
|
 |
D2PAK or DDPAK
-
Dou-ble
Decawatt Package |
|
 |
D3PAK
-
Decawatt Package
3 |
|
 |
DFN
-
Dual Flat No
Leads Package |
|
 |
DPAK
-
Decawatt Package |
|
 |
FBGA
-
Fine-Pitch
Ball Grid Array |
|
 |
JLCC
- J-Leaded Ceramic Chip Carrier
|
|
 |
LFBGA
- Low Profile Fine-Pitch Ball Grid Array
|
|
 |
LGA
- Land Grid Array
|
 |
LQFP
- Low-Profile Quad Flat Package
|
 |
MLP
- Micro Leadframe Package
|
 |
MQFP
- Metric Quad Flat Package
|
 |
MSOP
- Micro Small Outline Package
|
|
 |
PBGA - Plastic
Ball Grid
Array |
 |
PDIP - Plastic Dual-in-Line Package
|
 |
PLCC - Plastic Leaded Chip Carrier
|
|
 |
PPGA - Plastic
Pin Grid
Array |
 |
PQFN - Power Quad Flat No Leads Package |
|
|
 |
PQFP - Plastic Quad Flat Pack |
 |
PSOP - Power Small Outline Package |
|
 |
QFN -
Quad Flat No
Leads Package |
 |
QSOP -
Quarter Size
Outline Package |
 |
SBDIP - Sidebraze Dual-in-Line Package |
 |
SC-70 - Small Outline Transistor |
 |
SIP - Single-In-Line Package |
 |
SOIC - Small Outline IC Package |
 |
SOJ - Small Outline J-Lead Package |
 |
SOT-23 - Small Outline Transistor |
 |
SPDIP - Shrink Plastic Dual-in-Line Package
|
 |
SSOP - Shrink Small Outline Package
|
 |
TDFN - Thin Dual Flat
No
Leads Package |
 |
TFBGA - Thin
Fine-Pitch Ball Grid Array |
 |
TQFN - Thin Quad Flat
No
Leads Package |
 |
TQFP - Thin Quad Flat Pack
|
 |
TSOP - Thin Small Outline Package |
 |
TSSOP - Thin Shrink Small Outline Package |
 |
UTDFN - Ultra Thin Dual Flat No Leads Package |
 |
UTQFN - Ultra Thin Quad Flat No Leads Package |
|
 |
VFBGA - Very Thin Fine-Pitch Ball
Grid Array |
 |
VSOP - Very Small Outline Package |
 |
XDFN - Extreme Thin Dual Flat No Leads Package |
 |
XQFN - Extreme Thin Quad Flat No Leads Package |
|
