The
Shrink Small Outline Package,
or SSOP,
is a smaller or 'shrunk' version of the
SOIC package, having a compressed
body and a tightened lead pitch.
SSOP lead counts range from 8 to 64. SSOP body
widths come in 150, 209 and 300 mils while its body thickness typically
ranges from 1.65 mm to 1.85 mm. The SSOP package is JEDEC- and
EIAJ- compliant. SSOP's have solder-plated gull-wing leads that are
protruding from the longer sides of the package.
Table 1. Properties of
Some Examples of SSOP's
|
Part Number |
No.
of Pins |
Body
Width |
Pitch |
Qty
Per Tube |
Tape
Width |
Tape
Pitch |
Qty
13" Reel |
|
SSOP8 |
8 |
5.3mm |
.65mm |
156 |
12mm |
8mm |
2,500 |
|
SSOP14/16 |
14/16 |
5.3mm |
.65mm |
100/80 |
16mm |
12mm |
1,000 |
|
SSOP20/24 |
20/24 |
5.3mm |
.65mm |
66/62 |
16mm |
12mm |
1,000 |
|
SSOP28 |
28 |
5.3mm |
.65mm |
47 |
16mm |
12mm |
1,000 |
|
SSOP48 |
48 |
7.6mm |
1.27mm |
30 |
32mm |
12/16mm |
1,000 |
|
SSOP56 |
56 |
7.6mm |
1.27mm |
26 |
32mm |
12/16mm |
500 |
|
SSOP64 |
64 |
10.2mm |
.8mm |
— |
44mm |
16/24mm |
500 |
