The
Ultra Thin Dual Flat No Leads
package, or UTDFN,
is
a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead
of leads, it uses metal pads along two sides of the package body for
electrical connection to the outside world.
It is basically a thinner version of the thin dual flat no
leads (TDFN) package.
Typical UTDFN pad counts range from 6 to
14. The body thickness of UTDFN
packages typically ranges from 0.40 mm to 0.55 mm. The pad pitch
(distance between pads) used by UTDFN packages is
usually either 0.4 mm or 0.5 mm.
Table 1. Properties of
Some Examples of UTDFN's
|
No. of Pads |
Body
Size |
Body Thickness |
Pad Pitch |
|
6 |
1 mm x
1.2 mm |
0.50 mm |
0.4 mm |
|
6 |
3 mm x
3 mm |
0.55 mm |
0.5 mm |
|
8 |
2 mm x
2 mm |
0.55 mm |
0.45 mm |
|
10 |
3 mm x
3 mm |
0.55 mm |
0.5 mm |
|
14 |
3 mm x
4 mm |
0.55 mm |
0.5 mm |
