The
Extremely Thin Dual Flat No Leads
package, or XDFN,
is
a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead
of leads, it uses metal pads along two sides of the package body for
electrical connection to the outside world.
It is basically a thinner version of the ultra thin dual flat no
leads (UTDFN) package.
The body thickness of a typical XDFN
package has a maximum value of 0.4 mm. The pad pitch
(distance between pads) used by XDFN packages is
usually either 0.4 mm or 0.5 mm.
Table 1. Properties of
Some Examples of XDFN's
|
No. of Pads |
Body
Size |
Body Thickness |
Pad Pitch |
|
8 |
1.8 mm x
2.2 mm |
0.40 mm |
0.4 mm |
|
8 |
2 mm x
3 mm |
0.40 mm |
0.5 mm |
