The
Fine Pitch Ball
Grid Array,
or FPBGA or FBGA,
is
a smaller version of the
ball grid array (BGA)
package. As in all BGA packages, FBGA's use solder balls that are
arranged in a grid or
array at the bottom of the package body for external electrical
connection. However, the FBGA is near-chip-scale in size, with a
smaller and thinner body than
the standard BGA package. As its
name implies, it also features a finer ball pitch (smaller distance
between balls).
Typical FBGA's have ball counts that range
from 25 to 529 solder balls. The typical FBGA ball pitch is
0.8 mm to 1.0 mm, although thinner versions of the FBGA such as the
TFBGA and the VFBGA can have
ball pitches that are as low as 0.4 mm. A typical FBGA is about 1.3 mm
to 1.7 mm thick.
Table 1.
Properties of Some FBGA's
|
No. of
Balls |
Body
Size |
Package Height
(incl.
solder balls) |
Ball Pitch |
|
49 |
7 mm x 7
mm |
1.4 mm |
0.8 mm |
|
63 |
10 mm x 10
mm |
1.5 mm |
0.8 mm |
|
80 |
9 mm x 9
mm |
1.5 mm |
0.8 mm |
|
128 |
11 mm x 11
mm |
1.4 mm |
0.8 mm |
|
165 |
15 mm x 17
mm |
1.3 mm |
1.0 mm |
