TSSOP - Thin Shrink Small Outline Package

The Thin Shrink Small Outline Package, or TSSOP, is a rectangular surface mount plastic package with gull-wing leads. It has a smaller body and smaller lead pitch than the standard SOIC package. It is also smaller and thinner than a TSOP with the same lead count.

The TSSOP come in body sizes of 3.0mm, 4.4mm and 6.1mm. The 3.0-mm TSSOP body has a typical thickness of 0.85 mm while the 4.4 mm- and 6.1-mm bodies have a typical thickness of 0.9 mm. TSSOP lead counts range from 8 to 56. The standard lead pitch used by TSSOP's is 0.65mm. This package type is JEDEC-compliant. The table below shows a partial list of TSSOP package options.

Table 1. Properties of some TSSOP's

Part Number	No. of Pins	Body Width	Pitch	Tape Width	Tape Pitch	Qty Per Tube	Qty Per Reel
TSSOP8/10	8/10	3.0mm	.65mm	12mm	8mm	98	2,500
TSSOP14	14	4.4mm	.65mm	12/16mm	8mm	96	1,000/ 2,500
TSSOP28	28	4.4mm	.65mm	16mm	8/12mm	50	1,000
TSSOP28/32	28/32	6.1mm	.65mm	24mm	12mm	50/44	1,000
TSSOP38	38	6.1mm	.65mm	24mm	12mm	39	1,000
TSSOP48/56	48/56	6.1mm	.5mm	24mm	12mm	39/35	1,000
TSSOP56	56	4.4mm	.4mm	24mm	12mm	42	1,000
TSSOP64	64	6.1mm	.5mm	N/A	N/A	28	N/A
TSSOP80	80	6.1mm	.4mm	N/A	N/A	28	N/A

Figure 1. Examples of TSSOP's (not in scale with each other)

See more IC Package Types

HOME