TSOP - Thin Small Outline Package

The Thin Small Outline Package, or TSOP, is a rectangular IC package with a thickness of 1.0 mm. There are two types of TSOP's. The Type I TSOP has its leads protruding from the shorter edges of the package. The Type II TSOP has its leads protruding from the longer edges of the package.

TSOP lead counts range from 20 to 48. TSOP IC's are packed in JEDEC trays or tape and reel (quantities may vary).

Table 1. Properties of some Type 1 TSOP's

Part Number

No.
of Pins

Body Size

Lead
Pitch

Qty
Per Tray

Tape
Width

Tape
Pitch

Qty
13" Reel

TSOP20/24

20/24

6 x 14.4mm

.5mm

240

24mm

12mm

1,000

TSOP28

28

8.1 x 11.8mm

.55mm

234

24mm

12mm

1,000

TSOP28/32

28/32

8 x 18.4mm

.5mm

156

32mm

12/16mm

1,000

TSOP40

40

10 x 18.4mm

.5mm

120

32mm

16mm

1,000

TSOP48

48

12 x 18.4mm

.5mm

96

32mm

16mm

1,000

Table 2. Properties of some Type 2 TSOP's

Part Number

No.
of Pins

Body Size

Lead
Pitch

Qty
Per Tray

Tape
Width

Tape
Pitch

Qty
13" Reel

TSOP20/24/26

20/24/26

7.6 x 17.14mm

1.27mm

176

24mm

12mm

1,000

TSOP24/28

24/28

10.16 x 18.41mm

1.27mm

100

32mm

16mm

1,000

TSOP32

32

10.16 x 20.95mm

1.27mm

117

32mm

16mm

1,000

TSOP40/44

40/44

10.16 x 18.42mm

.8mm

135

32mm

16mm

1,000

TSOP50

50

10.16 x 20.95mm

.8mm

117

32mm

16mm

1,000

TSOP54

54

12.7 x 22.22mm

.8mm

84

44mm

20mm

1,000

TSOP66

66

10.16 x 22.22mm

.65mm

44mm

20mm

1,000

Figure 1. A Type 1 TSOP (left) and a Type 2 TSOP (right)

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