The
Very Thin
Profile Fine Pitch Ball
Grid Array,
or VFBGA,
is
a
thinner version of the
TFBGA package. Like all BGA packages, VFBGA's use solder balls that are
arranged in a grid or
array at the bottom of the package body for external electrical
connection. The VFBGA is near-chip-scale in size
and features ball pitch values that are
even tighter than those of the TFBGA.
Typical VFBGA's have ball counts that range
from 120 to 476 solder balls. The typical VFBGA ball pitch is 0.4 mm to
0.75 mm.
The typical VFBGA package thickness is greater than 0.80 mm
but not more than 1.0 mm.
Table 1.
Properties of Some VFBGA's
|
No. of
Balls |
Body
Size |
Package Height
(incl.
solder balls) |
Ball Pitch |
|
45 |
3 mm x 6 mm |
1.0 mm |
0.50 mm |
|
48 |
6 mm x 8
mm |
1.0 mm |
0.75 mm |
|
49 |
5 mm x 5
mm |
1.0 mm |
0.65 mm |
|
56 |
4.5 mm x 7
mm |
1.0 mm |
0.65 mm |
|
84 |
4.6 mm x
4.6
mm |
1.0 mm |
0.40 mm |
|
100 |
6 mm x 6
mm |
1.0 mm |
0.50 mm |
|
100 |
8 mm x 8
mm |
1.0 mm |
0.75 mm |
|
168 |
12 mm x 12
mm |
0.9 mm |
0.50 mm |
|
432 |
11 mm x 11
mm |
1.0 mm |
0.40 mm |
