VFBGA - Very Thin Profile Fine-Pitch Ball Grid Array

                                                  

The Very Thin Profile Fine Pitch Ball Grid Array, or VFBGA, is a thinner version of the TFBGA package. Like all BGA packages, VFBGA's use solder balls that are arranged in a grid or array at the bottom of the package body for external electrical connection.  The VFBGA is near-chip-scale in size and features ball pitch values that are even tighter than those of the TFBGA.

   

Typical VFBGA's have ball counts that range from 120 to 476 solder balls. The typical VFBGA ball pitch is 0.4 mm to 0.75 mm. The typical VFBGA package thickness is greater than 0.80 mm but not more than 1.0 mm.
      

Table 1. Properties of Some VFBGA's

No. of Balls

Body Size

Package Height

(incl. solder balls)

Ball Pitch

45

3 mm x 6 mm

1.0 mm

0.50 mm

48

6 mm x 8 mm

1.0 mm

0.75 mm

49

5 mm x 5 mm

1.0 mm

0.65 mm

56

4.5 mm x 7 mm

1.0 mm

0.65 mm

84

4.6 mm x 4.6 mm

1.0 mm

0.40 mm

100

6 mm x 6 mm

1.0 mm

0.50 mm

100

8 mm x 8 mm

1.0 mm

0.75 mm

168

12 mm x 12 mm

0.9 mm

0.50 mm

432

11 mm x 11 mm

1.0 mm

0.40 mm

   

Figure 1.  Top and bottom views of an example of a Very Thin Fine-Pitch Ball Grid Array (VFBGA)

      

See also:  Ball Grid Array (BGA)FBGATFBGA

See more IC Package Types

   

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