The
Power Small Outline Package,
or PSOP,
is a rectangular small outline IC package
developed by Amkor that integrates a copper heat slug in its plastic
body. The die is attached to this heat slug, increasing the chip's
ability to dissipate heat and thus handle more power. The PSOP
achieves 40% theta JA improvement over that of standard SOIC's.
The PSOP is offered with a low stand-off
of 2 mils (0.002 inch). The leads of the PSOP is mechanically
connected to but electrically isolated from the heat slug. Amkor offers
two types of PSOP: PSOP-2 and PSOP-3. The PSOP-2 has a standard
exposed heat slug while the PSOP-3 has an enlarged exposed heat slug
that protrudes out of the package bottom, allowing the slug to be
thermally connected to the PCB for greater heat dissipation capability.
Table 1.
Properties of some PSOP's of Amkor
|
Package
Type |
No.
of Pins |
Body Width |
Body Length |
Body Thickness |
Lead
Pitch |
Units/ Tube |
|
PSOP-2 |
8 |
3.8 mm |
4.93 mm |
1.52 mm |
1.27 mm |
97 |
|
PSOP-2 |
16 |
3.8 mm |
9.93 mm |
1.52 mm |
1.27 mm |
48 |
|
PSOP-2 |
16 |
7.6 mm |
10.33 mm |
2.34
mm |
1.27 mm |
46 |
|
PSOP-2 |
20 |
7.6 mm |
12.83 mm |
2.34
mm |
1.27 mm |
37 |
|
PSOP-2 |
24 |
7.6 mm |
15.42 mm |
2.34
mm |
1.27 mm |
31 |
|
PSOP-2 |
28 |
7.6 mm |
17.93 mm |
2.34 mm |
1.27 mm |
27 |
|
PSOP-3 |
20 |
11 mm |
15.90 mm |
3.15
mm |
1.27 mm |
31 |
|
PSOP-3 |
24 |
11 mm |
15.90 mm |
3.15
mm |
1.00 mm |
27 |
|
PSOP-3 |
30 |
11 mm |
15.90 mm |
3.15
mm |
0.80 mm |
27 |
|
PSOP-3 |
36 |
11 mm |
15.90 mm |
3.15
mm |
0.65 mm |
27 |
