The
Micro
Leadframe Package, or
MLP,
is
a JEDEC-compliant, very thin, near-CSP
square-shaped or rectangular surface-mount
plastic package
uses metal pads instead of leads for
electrical connection to the outside world. The MLP belongs to the
same 'no leads' package family as the QFN and the
DFN.
The MLP is available in three variants:
1) Dual MLP (MLPD), 2) Quad MLP (MLPQ), and 3) Micro MLP (MLPM).
The MLPD has pads on only two sides of its package body while the MLPQ
has pads all around the periphery of its package body. MLPMs are
smaller versions of the standard MLPs, with typical body sizes from 2 mm
square to 3 mm square.
MLPs usually have exposed die attach
pads to ensure good thermal conductivity when soldered onto the PCB.
Typical MLP pad counts range from 8 to 64. The body thickness of MLPs typically ranges from 0.60 mm to 0.90 mm. The pad pitch
(distance between pads) used by MLPs can range from 0.5 mm to 1.27 mm.
Table 1. Properties of
Some Examples of MLP's
|
Type |
No. of Pads |
Body
Size |
Body Thickness |
Pad Pitch |
|
MLPM |
8 |
2 mm x
3 mm |
0.90 mm |
0.65 mm |
|
MLPM |
8 |
3 mm x
3 mm |
0.90 mm |
0.95 mm |
|
MLPD |
8 |
5 mm x
6 mm |
0.80 mm |
1.27 mm |
|
MLPQ |
20 |
4 mm x
4 mm |
0.88 mm |
0.5 mm |
|
MLPQ |
48 |
7 mm x
7 mm |
0.90 mm |
0.5 mm |
|
MLPQ |
56 |
8 mm x
8 mm |
0.88 mm |
0.5 mm |
