SOIC -
Small Outline Integrated Circuit
The
'Small Outline
Integrated Circuit',
or SOIC,
is a small rectangular surface-mount plastic-molded integrated circuit package with gull wing leads. The leads protrude from the longer edge of the
package. It is one of the most commonly used surface mount packages today.
SOIC packages are JEDEC-compliant, and come in a variety of body
widths, the most popular of which are 150 mils or 3.8 mm (narrow body) and 300 mils
or 7.5 mm (wide body). The standard SOIC lead pitch is nominally 50 mils (1.27
mm). The SOIC may be shipped in tubes or tape and reel.
A similar package outline that has J-formed leads instead of gull wing
leads is known as the SOJ.
Table 1. Properties of some SOIC's
Number
of Pins |
Body
Size |
Body
Thickness |
Lead
Pitch |
8 |
3.8 mm
x 4.9 mm
|
1.45
mm |
1.27
mm |
14
|
3.8 mm
x 8.6 mm
|
1.45
mm |
1.27
mm |
16 |
3.8
mm x 9.9 mm |
1.55
mm |
1.27
mm |
20 |
7.5
mm x 12.8 mm |
2.4
mm |
1.27
mm |
24 |
7.5
mm x 15.4 mm |
2.5
mm |
1.27
mm |
28 |
7.5
mm x 17.9 mm |
2.5
mm |
1.27
mm |
32 |
7.5
mm x 11 mm |
2.35
mm |
0.65
mm |
|
Figure 1.
Examples of SOIC's: 8-lead SOIC (left) and 28-lead SOIC (right) |
See
also:
SOIC/SOJ Packing in Tubes and Tape and
Reel
See more IC Package Types
HOME
Copyright
©
2001 www.EESemi.com.
All Rights Reserved.