|
Method
No.
|
Name
of Method
|
Purpose
|
Equipment
Needed
|
|
2001
|
Constant
Acceleration
|
To determine the effects of constant
acceleration on microelectronic devices |
Uses an apparatus that can apply
specified acceleration for the required time |
|
2002
|
Mechanical
Shock
|
To determine the suitability of devices
for use in equipment subjected to moderately severe shocks |
Uses an apparatus capable of providing
shock pulses of 500 to 30000 g for 0.1 to 1 ms |
|
2003
|
Solderability
Test
|
To evaluate the solderability of
terminations joined by soldering |
Uses a solder pot, a dipping mechanism,
and a steam ager |
|
2004
|
Lead
Integrity Test
|
To determine the integrity of
microelectronic device leads, welds, and seals |
Requires clamps and fixtures to secure
the device and attaching weights to the leads |
|
2005/
2007
|
Vibration
Tests (fatigue/variable frequency)
|
To determine the effect of vibration on
components in the specified frequency range |
Uses equipment capable of providing the
required vibration at the specified levels |
|
2009
|
External
Visual Inspection
|
To verify the workmanship of
hermetically packaged devices |
Uses optical inspection
equip- ment
capable of 1.5X-10X mag |
|
2010
|
Internal
Visual Inspection
|
To check the internal materials,
construction, and workmanship of microcircuits |
Uses optical inspection equipment
capable of the specified magnification |
|
2011
|
Bond
Strength Test
|
To measure bond strengths and evaluate
bond strength distributions |
Uses equipment capable of applying the
specified stress to the bond, lead wire, or terminal |
|
2015
|
Resistance
to Solvents Test
|
To
verify that the markings will not become illegible when the part is
subjected to solvents |
Uses
a vessel made of inert material and of sufficient size to permit
complete immersion of specimens in solvents |
|
2016
|
Physical
Dimensions Test
|
To
verify that the external physical dimensions of the device meet the
requirements |
Uses
micrometers, calipers, gauges, contour projectors, etc. |
|
2019
|
Die
Shear Strength Test
|
To
determine the integrity of materials and procedures used to attach
semiconductor die |
Uses
a load-applying instrument with an accuracy of +/-5% of full scale
or 50 grams |
|
2020
|
PIND Test
|
To
detect loose particles inside a device cavity |
Uses
a Particle Impact Noise Detection (PIND) System |
|
2021
|
Glassivation
Layer Integrity Test
|
To
assess the structural quality of deposited dielectric films or
glassivation over the die |
Uses
a suitable sample handling equipment chemical etching
facilities |
|
2024
|
Lid
Torque Test
|
To
determine the shear strength of the seal of glass-frit-sealed
packages |
Uses
an equipment that applies torque to the seal of the sample |
|
2025
|
Adhesion
of Lead Finish Test
|
To
determine the integrity of all primary and undercoat lead finishes |
Uses
suitable clamps and fixtures for bending stresses to
the lead at specified angles |
