Constant
Acceleration Test - Mil-Std-883 Method 2001
The
Constant Acceleration Test,
as its name implies, is a test performed to determine the effects of
constant acceleration on semiconductor devices.
Mil-Std-883 Method 2001 is the most widely-used industry standard for
performing this test.
Constant acceleration testing is
designed specifically to uncover structural and mechanical
weaknesses in the semiconductor package that are not necessarily
detectable by other mechanical stress tests, such as the mechanical
shock test and the vibration test.
It may be used as a
high-stress test to determine the
limits
of the mechanical
strengths of the various features of the package, i.e., the internal
metallization and lead system, the die and die attach system, the wire
bond system, etc. At lower and non-destructive levels of stress
settings, it may also be utilized as a
100% in-line screen
to identify and reject devices that exhibit lower than nominal
mechanical strengths in any of the package's structural elements.
The constant acceleration test employs
an apparatus capable of applying the specified acceleration to the
devices being tested for the required period of time.
The devices to be
subjected to constant acceleration testing shall be restrained by its
case or body, or by normal mountings, with its leads and cables (if any)
secured very well. Unless otherwise specified, the required value
of constant acceleration shall then be applied to the samples for 1
minute in each of the following
orientations:
X1, X2, Y2, Y1, Z1, and Z2. For devices with internal elements mounted
with the major seating plane perpendicular to the Y axis, the Y1
orientation is defined as the one that tends to displace the elements
from their mount.
Table 1 shows the various
test conditions for constant acceleration testing as defined by
Mil-Std-883 Method 2001.
Test condition E
shall apply, unless otherwise stated.
Table 1. Test Conditions for
Constant Acceleration Testing
per Mil-Std-883 Method 2001
Test Condition |
Stress Level (g) |
A |
5,000 |
B |
10,000 |
C |
15,000 |
D |
20,000 |
E |
30,000 |
F |
50,000 |
G |
75,000 |
H |
100,000 |
J |
125,000 |
The following shall be indicated in the
acquisition document:
1) test condition or amount of acceleration applied in gravity units
(g); 2) measurements to be made after the stress test, if any; 3) any
variations or limitations to the test orientation used; and 4) the
sequence of orientations, if other than what was specified by
Mil-Std-883 Method 2001.
Reference:
Mil-Std-883 Method 2001
Reliability
Tests:
Autoclave
Test or PCT; Temperature
Cycling; Thermal
Shock;
THB;
HAST;
HTOL;
LTOL;
HTS; Solder
Heat Resistance Test (SHRT);
Other
Reliability Tests
See Also:
Reliability
Engineering;
Reliability Modeling; Qualification
Process; Failure
Analysis;
Package Failures; Die
Failures
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