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Mil-Std-883
Method 5005 Quality Conformance Inspection
(QCI) Group
Tests:
Group A and
Group C Tests
The following
group tests are used for qualifications or quality conformance
inspections of semiconductor products used for military purposes.
Table 1.
Mil-Std-883 Method 5005 Group A Electrical Tests
(for
Class-S and Class-B Devices)
|
Subgroup |
Examination/Test |
SS |
Accept # |
Conditions |
|
Subgroup
1 |
Static Tests |
116 |
0 reject |
Tamb = 25 deg
C |
|
Subgroup
2 |
Static Tests |
116 |
0 reject |
Tamb = Tmax |
|
Subgroup
3 |
Static Tests |
116 |
0 reject |
Tamb = Tmin |
|
Subgroup
4 |
Dynamic Tests |
116 |
0 reject |
Tamb = 25 deg
C |
|
Subgroup
5 |
Dynamic Tests |
116 |
0 reject |
Tamb = Tmax |
|
Subgroup
6 |
Dynamic Tests |
116 |
0 reject |
Tamb = Tmin |
|
Subgroup
7 |
Functional Tests |
116 |
0 reject |
Tamb = 25 deg
C |
|
Subgroup
8 |
Functional Tests |
116 |
0 reject |
Tamb = Tmax |
|
Subgroup
8b |
Functional Tests |
116 |
0 reject |
Tamb = Tmin |
|
Subgroup
9 |
Switching Tests |
116 |
0 reject |
Tamb = 25 deg
C |
|
Subgroup
10 |
Switching Tests |
116 |
0 reject |
Tamb = Tmax |
|
Subgroup
11 |
Switching Tests |
116 |
0 reject |
Tamb = Tmin |
Table 2.
Mil-Std-883 Method 5005 Group C (Die-Related) Tests
(for
Class-B Devices Only)
|
Subgroup |
Tests /Conditions |
SS |
Accept # |
|
Subgroup
1
|
a.
Steady-state Life Test -
Mil-Std-883 Method 1005
-
use bias conditions per
device specifications;
- 1000 hours at 125 deg C
or equivalent per Table I of Method 1005
|
45 |
0 reject |
|
b.
End-point electrical parameters
-
Per the applicable
device specifications |
45 |
0 reject |
Table 3.
Mil-Std-883 Method 5005 Group B
Tests
(for
Class-S and Class-B Devices)
|
Subgroup |
Tests /Conditions |
SS |
Accept # |
|
Subgroup
1
(not
required for Class B)
|
a.
Physical Dimensions - Mil-Std-883 Method 2016
|
2 |
0 reject |
|
b.
Internal Water Vapor Content - Mil-Std-883 Method 1018 |
3 (or 5) |
0 reject
for SS=3;
1 reject
for SS=5 |
|
Subgroup
2
|
a.
Resistance to Solvents - Mil-Std-883 Method 2015
|
3 |
0 reject |
|
b.
Internal Visual Inspection - Mil-Std-883 Method 2010 (not required
for Class B)
|
2 |
0 reject |
|
c.
Bond Strength Test - Mil-Std-883 Method 2011
1)
Thermocompression - Cond. C or D
2)
Ultrasonic or Wedge - Cond. C or D
3)
Flip-chip - Cond. F
4) Beam
Lead - Cond. H
|
Class S
-22 wires;
Class B
-15 wires |
0 reject |
|
d.
Die Shear / Substrate Attach Test - Mil-Std-883 Method 2019 or
2027 (not required for Class B)
|
3 |
0 reject |
|
Subgroup
3
|
a.
Solderability Test - Mil-Std-883 Method 2003
-
soldering temperature of 245 C +/-5 C
|
22 leads |
0 reject |
|
Subgroup
4
(not
required for Class B)
|
a.
Lead Integrity - Mil-Std-883 Method 2004
- test condition B2 (Lead Fatigue)
|
45 |
0 reject |
|
b. Seal
Integrity - Mil-Std-883 Method 1014
1)
Fine Leak Test
2) Gross
Leak Test
|
15 |
0 reject |
|
c.
Lid Torque Test - Mil-Std-883 Method 2024 |
5 |
0 reject |
|
Subgroup
5
(not
required for Class B)
|
a.
End-point electrical parameters
- Per
the applicable device specifications
|
45 |
0 reject |
|
a.
Steady-state Life Test -
Mil-Std-883 Method 1005
- use bias conditions per
device specifications;
- 1000 hours at 125 deg C
or equivalent per Table I of Method 1005
|
45
|
0 reject |
|
c.
End-point electrical parameters
- Per
the applicable device specifications
|
45 |
0 reject |
|
Subgroup
6
(not
required for Class B)
|
a.
End-point electrical parameters
- Per
the applicable device specifications
|
15 |
0 reject |
|
b.
Temperature Cycle - Mil-Std-883 Method 1010
- test
condition C, 100X min.
|
15 |
0 reject |
|
c.
Constant Acceleration - Mil-Std-883 Method
2001- test
condition E min.
|
15 |
0 reject |
|
d. Seal
Integrity - Mil-Std-883 Method 1014
1)
Fine Leak Test
2) Gross
Leak Test
|
15 |
0 reject |
|
e.
End-point electrical parameters
- Per
the applicable device specifications
|
15 |
0 reject |
Table 4.
Mil-Std-883 Method 5005 Group D (Package-Related) Tests
(for
all Classes of devices )
|
Subgroup |
Tests /Conditions |
SS |
Accept # |
|
Subgroup
1
|
a.
Physical Dimensions - Mil-Std-883 Method 2016
|
15 |
0 reject |
|
Subgroup
2
|
a.
Lead Integrity - Mil-Std-883 Method 2004
- test condition B2 (Lead Fatigue)
|
45 |
0 reject |
|
b.
Seal Integrity - Mil-Std-883 Method 1014
1)
Fine Leak Test
2) Gross
Leak Test
|
45 |
0 reject |
|
Subgroup
3
|
a.
Thermal Shock - Mil-Std-883 Method 1011
- test condition B min.; 15X min.
|
15 |
0 reject |
|
b.
Temperature Cycle - Mil-Std-883 Method 1010
- test
condition C, 100X min.
|
15 |
0 reject |
|
c.
Moisture Resistance - Mil-Std-883 Method 1004
|
15 |
0 reject |
|
d.
Visual Inspection - per criteria in Mil-Std-883 Methods 1004 and
1010
|
15 |
0 reject |
|
e.
Seal Integrity - Mil-Std-883 Method 1014
1)
Fine Leak Test
2) Gross
Leak Test
|
15 |
0 reject |
|
f.
End-point electrical parameters
- Per
the applicable device specifications
|
15 |
0 reject |
|
Subgroup
4
|
a.
Mechanical Shock - Mil-Std-883 Method 2002
- test
condition B min.
|
15 |
0 reject |
|
b.
Vibration Test, Variable Frequency - Mil-Std-883 Method 2007
- test
condition A min.
|
15 |
0 reject |
|
c.
Constant Acceleration - Mil-Std-883 Method
2001
- test
condition E min.
|
15 |
0 reject |
|
d. Seal
Integrity - Mil-Std-883 Method 1014
1)
Fine Leak Test
2) Gross
Leak Test
|
15 |
0 reject |
|
e.
Visual Inspection - per criteria in Mil-Std-883 Methods 1010 or
1011
|
15 |
0 reject |
|
f.
End-point electrical parameters
- Per
the applicable device specifications
|
15 |
0 reject |
|
Subgroup
5
|
a.
Salt Atmosphere Test - Mil-Std-883 Method 1009
|
15 |
0 reject |
|
b.
Visual Inspection - per criteria in Mil-Std-883 Method 1009
|
15 |
0 reject |
|
c.
Seal Integrity - Mil-Std-883 Method 1014
1)
Fine Leak Test
2) Gross
Leak Test
|
15 |
0 reject |
|
Subgroup
6
|
a.
Internal Water Vapor Content - Mil-Std-883 Method 1018
- 5,000
ppm max water content at 100C
|
3 (or 5) |
0 reject
for SS=3;
1 reject
for SS=5 |
|
Subgroup
7
|
a.
Adhesion of Lead Finish - Mil-Std-883 Method 2025
|
15 |
0 reject |
|
Subgroup
8
|
a.
Lid Torque Test - Mil-Std-883 Method 2024
|
5 |
0 reject |
Disclaimer:
The original
document from which the information on this web page were taken,
Mil-Std-883 Method 5005, contains
many notes that do not appear on this page. Thus, people are
advised to use this web page in conjunction with the original document.
See Also:
Mil-Std-883 Methods;
Mil-PRF-38535;
Mil
Lot Screen Tests (Method 5004);
Reliability
Engineering; Reliability Tests
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