Package cracking - occurrence of fracture anywhere in the package

Package stress-related electrical failure - non-conformance to electrical specifications due to component degradation caused by stresses on the die surface

Wiresweeping - swaying or movement of the wires during molding along the direction of mold flow which may result in broken wires or wire shorting

Package Voids and Pits - imperfections on the package surface (pits) or body (voids) characterized by vacancies of plastic material

Incomplete Filling - insufficient encapsulation resulting when the molding compound fails to fill up the cavity during molding

Blistering - appearance of blisters on the package surface

Package Delamination - any disbonding between the molding compound and another material of the package 

Excessive Flashes - presence of unacceptable amounts of  plastic on the edges of the package after molding

Solder Voids - exposure of any part of the lead base metal resulting when excess flashes that covered the leads during leadfinish are removed

Mark Permanence Failure - inability of the entirety of an ink  mark to remain on the package

Front-End Assembly Links:  Wafer Backgrind;  Die Preparation;  Die Attach;  Wirebonding;  Die Overcoat

Back-End Assembly Links:  Molding;  Sealing;  Marking;  DTFS;  Leadfinish          

See Also:  IC Manufacturing;  Assembly Equipment