DTFS
Deflash/Trim/Form/Singulation
(DTFS)
consists of
the four steps indicated in its name. These steps are defined below.
1.
Deflash
- removal of flashes from the package of the newly molded
parts.. Flashes are the excess plastic material sticking out of
the package edges right after molding.
2.
Trim - cutting of the dambars that short the leads together.
3.
Form - forming of the leads into the correct shape and position.
4.
Singulation - cutting of the tie bars that attach the individual units
to the leadframe, resulting in the individual separation of each unit
from the leadframe.
Figure 1.
Examples of TFS Equipment
Common
DTFS-related
Failure Mechanisms:
Package Cracking
- occurrence of fracture anywhere in the package, often due to
excessive mechanical stresses imparted by the DTFS process to the
package.
Die
Cracking - occurrence of fracture anywhere in the die. In
the context of DTFS, die cracking is commonly caused by excessive
mechanical stresses imparted by the DTFS process to the package,
which may be transmitted to the die. In some cases, the
package will withstand these stresses but the die will not.
Front-End Assembly
Links:
Wafer Backgrind;
Die Preparation;
Die Attach;
Wirebonding;
Die Overcoat
Back-End Assembly
Links:
Molding;
Sealing;
Marking;
Leadfinish
See Also:
IC
Manufacturing; Assembly Equipment
HOME
Copyright
©
2001-2006
www.EESemi.com.
All Rights Reserved.
