Ball Bond 
        Neck Breaks
        
        
        
           
        
        
        
        
        
        
        
        
        
        
        
        
        
        Neck Breaking
        
        is the 
        severing of the wire from its ball bond due to a 
        
        fracture in the neck.  The
        
        neck is the portion of the wire where the wire meets the ball bond. The 
        geometrical transition of the wire at the neck makes this portion 
        vulnerable to the thermo-mechanical stresses that the wires are 
        subjected to.
		
		    
		
		
		
		
		
		
        
        
        
        
        
        
        
        
        
        
        
        
        
		
		
		
		
		
		
		
		
		
		
		
        
        
        
        
        
		
		
		
		
		
		
		
		
		
		
		
		
         Neck Breaking is commonly due to  
        
        poor wirebonder set-up. Poor set-up includes improper bonding parameter settings, bond head movement settings, and worn-out or contaminated tools. 
        Incorrect bonding parameters can deform the bond excessively,
        resulting in a thin, weak, or cracked neck which can easily fracture.
        Improper bond head movements and low loop settings may subject the wires
        to excessive stresses that can result in gross neck cracks which may
        propagate into total fracture (see Figure 1).  Worn-out
        and contaminated tools can produce mechanical damage or defects in the wires which can act as
        starting points for crack propagation.
        
        
        
            
        
        
        
        
        
        Die overcoat 
        material reaching the neck regions of the bonds can likewise cause neck 
        breaks.  Silicone gel coat
        exerts tremendous forces on the wires if the unit is subjected to 
        excessive thermal stresses, pulling the necks away from their ball bonds. This mechanism can be easily prevented though by limiting the
        die coat thickness, i.e., not letting the die coat level reach the neck 
        portion of the wires.
        
        
		
		    
        
        
        
        
        
        
        
        
        
        
        
          
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        Figure 1. 
        Neck Cracking that can lead to a Neck Break 
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        Neck
        breaks as a result of 
        
        wire sweeping during molding can also occur. 
        Excessive wire sweeping produces both a linear and angular
        displacement of the wire, which tend to pull on and twist the neck of
        the ball bond.  The neck is
        severed if its fracture strength is exceeded by the resultant stress.
        Taut wires and low loop heights aggravate the effects of wire sweeping.
        Die-to-plastic delaminations, such as those induced by an improper DTFS
        process, can likewise result in neck breaks, since any movement of the
        delaminated plastic with respect to the die would tend to pull away the
        wires from the die.
        
        
        
         
        
        
        
        
        Corrosion, 
        which can significantly reduce the diameter of a bond wire, can also 
        lead to neck breaks. 
         It is often due to the 
        presence of corrosive contaminants
        such as Cl and S
        in the wires and bonds.
        
            
        
        
        
        
        
        
        
        
        
        
        
        
        
        Neck breaking 
        may be 
        accelerated 
        by SHRT, 
        Temp Cycle, and Thermal Shock.
        
        
		
		    
		
		
		
		
		
		
        
        
        
        
        
        
        
        
        
        
        
        
        
		
		
		
		
		
		
		
		
		
		
		
        
        
        
        
        
		
		
		
		
		
		
		
		
		
		
		
        See also:
        
        
        
        
        
        
        
        
        
        
        
        
        
        Heel Breaks;  
        Package 
      Failure Mechanisms;  Wirebonding;  Failure Analysis
        
        
        
        
        
        
        
        
        
        
		
                 
        
        
        
        
        
        
        
        
        
        
        
        
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