Package Failure Mechanisms

Package-related Failure Mechanisms and Attributes

<Proceed to Page 2> <Proceed to Page 3>

Ball Lifting

Ball lifting, is the detachment of a ball bond from the bond pad of a semiconductor device.

See separate article on ball lifting.

Bond Shorting

Bond Shorting is the presence of an unintended electrical connection between two bonds.

See separate article on wirebond-related shorts.

Contamination, External

External contamination is the presence of a foreign material, whether attached or unattached, anywhere on the external portions of the package and leads.

See separate article on external package contamination.

Contamination, Internal

Internal contamination is the presence of a foreign material, whether attached or unattached, anywhere inside the package of the device.

See separate article on internal package contamination.

Cratering

Cratering is a partial or total fracture of the silicon material underneath the bond pad. Cratering is commonly due to excessive stresses on the bond pads from a poorly set up wirebonding machine. Bonding time, force and power are critical parameters when dealing with cratering.

Die Chip-outs

Die chipping is a failure mechanism wherein a part or parts of the die break away from the die itself.

See separate article on die chipping.

Die Corrosion

Die corrosion refers to the corrosion of the metal areas on the surface of the die.

See separate article on die corrosion.

Die Cracking

Die cracking is the occurrence of fracture(s) in or on any part of the die.

See separate article on die cracking.

Die Lifting

Die lifting is the disbonding or detachment of the die from its die pad or die cavity.

See separate article on die lifting.

Die Scratches

Die scratch is the presence of abrasion, scraping, or laceration damage on the surface of the die.

See separate article on die scratching.

<Proceed to Page 2>

<Proceed to Page 3>

HOME