EESemi.com Forum Archives
Reliability Assessment for a
Cratering Issue
The term 'cratering'
refers to silicon damage under the bond pad caused by excessive
wirebonding. Subtle cases would show
microcracks in the silicon under the bond pad, but extreme cases would
result in chunks of silicon being displaced, hence the name 'cratering'.
Cratering is a serious reliability issue because they can go undetected
during production, leading to field failures later on. The
archived forum thread below discusses appropriate
reliability tests that can be done on
samples from lots being suspected of having latent or incipient
cratering damage.
Posted by Rivs: Wed
Dec 12, 2007 10:32 am Post
subject: Cratering Issue |
|
guys I need you help on what
reliability test to perform on cratering affected units,
thanks |
|
|
Posted by FARel Engr:
Thu Dec 13, 2007 11:17 pm
Post subject: |
|
As a minimum you should do
preconditioned TCT on an adequate number of samples.
Aside from the usual readpoints, you must perform a
thorough inspection of the Si under the bond pads after
the precon, and after the TCT. Thus, you need to have
enough samples to account for sample 'losses' after each
'crater check' since this procedure is destructive. |
|
|
Posted by Paula: Fri
Dec 14, 2007 5:23 pm Post
subject: |
|
Sa tingin ko wala appropriate rel
test for bondpad cratering. Usually, scrap na yung
affected lot.
Try mo mag-crater test sa mga good units, medyo malaking
sample size, pag meron cratering ibig sabihin- test
can't weed out units with cratering. I don't see a
reason bakit kailangan pa ng rel test.
My thoughts. |
|
|
Posted by Rivs: Sat
Dec 15, 2007 7:58 am Post
subject: |
|
thanks guys.
yes paula even good units have cratering. reliability
test purpose is to check if the device (good affected
with cratering) will still pass.
Rejected parts failed leakage parameters werein
cratering is not the main suspect, as experienced device
affected with cratering fails breakdown voltage
(shorted).
Also rejected parts have undergone microthermography
(liquid crystal technique) and hotspot was seen on the
gate runners while none seen on the good units but after
crater test we found out that cratering is evident on
both good and rejected parts.
Anyway thanks for the help guys I highly appreciated the
responses [/b] |
|
|
Posted by FARel Engr:
Thu Dec 20, 2007 3:55 am
Post subject: |
|
The rel tests that I earlier
recommended is to confirm if other lots are affected by
the same cratering issue (containment of affected lots)
- not to determine if affected lots will survive in the
field. I agree with Paula on the point that lots already
known to be affected by cratering need to be scrapped.
However, lots suspected to be affected, but not yet
confirmed to be affected, will benefit from rel testing,
since it would also not be wise to just scrap lots on
the mere suspicion of being affected, unless the process
that caused the cratering has been identified and the
suspected lots underwent the same process. |
|
|
Posted by Rivs: Thu
Dec 20, 2007 8:11 am Post
subject: |
|
However, lots suspected to be affected, but not yet
confirmed to be affected, will benefit from rel testing,
since it would also not be wise to just scrap lots on
the mere suspicion of being affected, unless the process
that caused the cratering has been identified and the
suspected lots underwent the same process.
Hi farel engr,
thank you very much for the response. |
|
Back to the 'Best of Forums' Archives
HOME
Copyright
©
2008
EESemi.com.
All Rights Reserved. |
|
|