This is a video showing the die attach process, which is also known as 'die bonding' or 'die mounting'. 'Die Attach', as its name implies, is the process of attaching the die (the silicon chip itself) on the die pad in the leadframe or substrate of the device package. This is done by putting a small amount of adhesive on the die pad and then mounting the die over this patch of adhesive.
Posted in YouTube by: twloo, April 05, 2008