TO-257 Package

                                                  

The TO-257 is a type of "transistor outline" package that features a metallic body with a flat metal tab at its back (see Figure 1) to enable it to dissipate relatively large amounts of heat. The TO-257 is very similar to the TO-254. The  TO-257 is the metal body equivalent of the popular plastic-molded TO-220. 

   

Unlike the TO-220, however, the TO-257 is hermetically sealed to protect the device from environmental factors such as contaminants and moisture.  The leads protrude from the bottom of the package through glass and ceramic feed-throughs that insulate them from the metal body.

  

The TO-257 is commonly used for housing transistors, thyristors, and integrated circuits with low lead counts such as voltage regulators that are intended for high-reliability and mission-critical circuits. The metal body of the TO-257 and its hermetic sealing make it more expensive than an ordinary TO-220, but also make it more reliable. 

       

The metal tab at the back of the TO-257 serves as a heat sink itself, but it has a hole so that it can be screwed onto a larger heat sink if higher power handling capability is required.

   

A typical TO-257 package has 3 leads, although TO-257's with other lead counts may be encountered.  The typical lead pitch (distance between leads) of a 3-lead TO-257 package is 2.54 mm. Several TO-257 variants with different lead formations (i.e., bending of the leads into specific shapes) are also offered in the market.  TO-257 packages without a metal tab at the back, also known as tabless TO-257, are also available.

   

Table 1. Properties of a Typical TO-257

Body Size (HxW)

 excl. Metal Tab

Body Size (HxW)incl. Metal Tab

Body Thickness

(inc. tab)

Metal Tab Thickness

Lead Length

10.5 mm x 10.5 mm

16.6 mm x 10.5 mm

5 mm

1 mm

15.9 mm

   

Figure 1.  Graphical Representation of a TO-257 Package

             

See more TO Package Types

See more IC Package Types

   

HOME

                       

Copyright © 2008 www.EESemi.com. All Rights Reserved.