Semiconductor Back-end Subcontractors

Disclaimers:  We constructed this page merely in response to numerous requests from our readers to feature the various semiconductor assembly and test  subcontractors in existence today.  The information contained in the following sections were all taken from the internet, and are therefore limited in content and scope, and possibly not current as well.  Furthermore, all descriptions pertaining to each of the subcontractors were lifted directly from the subcontractors' respective websites, with minimal editing on our part, if at all.  We are not making any endorsements for and on behalf of any of these subcontractors, and will not be responsible for any effects that use of the following information will have on any entity.  Readers are advised to visit the websites of these subcontractors if they need more information.

Shortcuts:  AMKOR;  ASAT;  ASE;  OSE;  SPEL;  STATS;  IC Assembly

AMKOR

Amkor is a strategic contract manufacturing resource for many of the world's leading semiconductor companies. They have developed unique expertise in high-volume manufacturing techniques and have diversified and expanded their operational scope by establishing production centers in strategic locations throughout Asia.

Amkor provides leading-edge package solutions such as Stacked Packaging, Flip Chip, MicroLeadFrame, System-in-Package, Image Sensors, MEMS, and MMC / SD for latest generation applications.

Amkor supplements its world-class operational scope with the industry's largest package design staff, broadest portfolio of packaging technology, deepest sales and support organization.

As integrated circuits increase in speed and complexity, the right semiconductor packaging becomes critical to ensure optimal system performance. Amkor is an industry leader in tailoring application-specific package design, assembly and test solutions.

Amkor offers the industry's broadest array of package formats and sizes, from traditional, "off-the-shelf" leadframe configurations to leading-edge chip scale, flip chip and system-in-package solutions incorporating highly customized designs. This allows Amkor to be a single source for many of our customers' total IC packaging requirements.

Amkor also provides a complete range of test engineering services for RF, mixed signal, logic and memory devices, from test program development to full product characterization. Amkor is a major provider of RF test services and is the world leader in Strip Test, an innovative, highly parallel test solution that offers customers low cost, faster index time and improved test yields.

With Amkor providing turnkey solutions that include semiconductor design, packaging, test and drop-shipment services, our customers can get accelerate time-to-revenue for their new products.

Amkor collaborates with customers and leading OEMs to develop comprehensive package solutions that make it easier for next-generation semiconductors to be designed into next-generation end products. By sharing device, package and product roadmaps we enable our customers - and their customers - to accelerate the development and deployment of new microelectronic applications.

Focusing on our core competencies allows our customers to optimize their assets and reduce time-to-sales.

Table 1.  Packages Offered by Amkor as of October, 2004

As the demand for outsourcing continues to grow and supply chains continue to shorten, Amkor is committed to increase our role in the customers' value chain. To this end, Amkor offers a full line of value-added services.

By becoming involved in the customers' projects as early as possible, Amkor feels they can add benefits such as Electrical Package Characterization and Thermal Package Characterization. Using these two Amkor specialized services, customers can better understand how their device will react both electrically and thermally once it inside a finished package. Knowing this at the beginning of the design phase helps designers make better decisions for a superior performing end product.

Getting involved at the die design phase also allows Amkor's Packaging Design Center to create the optimum package for any device. Our design experts can advise on how specific aspects of the device will interact with a given package design to help optimize the device performance.

Adding to this, Amkor has the expertise and experience to provide probe or test solutions for the entire spectrum of integrated circuits through our many Test Services facilities. Located worldwide for customer convenience, Amkor offers test services for any device, from simple digital logic, complex ASIC, high speed digital, memory, mixed signal and RF/Wireless devices.

These services along with several others such as Die Processing, Package Signal Integrity Analysis, Failure Analysis, Qualification Testing, Engineering Support and an Online Customer Center combine to make Amkor a valuable link in the customers supply chain.

Table 2. Amkor's Manufacturing & Test Facilities as of October, 2004

ASAT

ASAT Holdings Limited is a global provider of semiconductor assembly, test and package design services. With 15 years of experience (as of 2004), the Company offers a definitive selection of semiconductor packages and world-class manufacturing lines. ASAT’s advanced package portfolio includes standard and high thermal performance ball grid arrays, leadless plastic chip carriers, thin array plastic packages, system-in-package and flip chip. The Company has operations in the United States, Asia and Europe. ASAT Inc. is a wholly owned subsidiary of ASAT Holdings Limited and the exclusive representative of services in North America.
  
Peak Performance Initiative

  
CEO Harry Rozakis launched ASAT's Peak Performance Initiative to drive ASAT to become the leader in advanced semiconductor package development, by setting industry standards for acceptance, performance, reliability, and time-to-revenue. ASAT created quantifiable goals on a department-by-department basis, with supporting benchmarks designed to deliver lower costs, lower risks and higher profits for both customers and the Company.

Table 3. ASAT's Products as of October, 2004

In 2001, ASAT introduced the development of its MSL-1 process resulting in unlimited shelf life for all lead frame-based products. MSL-1 is the JEDEC standard J-STD 020 which guarantees unlimited shelf life for packages stored at standard temperature in an uncontrolled environment. As a result, the baking process step, often required prior to mounting the package on a board or module, is eliminated. This new development will have significant economic benefits for the end user equipment manufacturer.

ASAT is a leading global provider of semiconductor assembly, test, and package design services. With almost 15 years of experience, and a reputation as a leader in advanced packaging technology, the Company offers a definitive selection of semiconductor packages and specialized services including test, design and analysis.

Table 4. ASAT's Services as of October, 2004

ASE

ASE Inc. provides a complete solution of semiconductor backend manufacturing services to its customers, including front-end engineering testing, wafer probing, final testing of logic, mixed signal, and memory semiconductors, and her test-related services. Its testing services employ technology and expertise that are among the most advanced in the semiconductor industry.

ASE Inc’s comprehensive manufacturing and service capabilities enables it to offer customers a high degree of flexibility and efficiency. They provide worldwide customers with engineering test, package and substrate and design, manufacturing, assembly, wafer probing, final test and design manufacturing services (DMS).

Leveraging its own core competencies, ASE addresses the backend challenges of increased product sophistication of systems, and the burgeoning capital requirements off advanced 300mm backend packaging and test functions.

With its flagship manufacturing facilities located in the heart of the world’s leading semiconductor manufacturing center – known as the Taiwan Cluster, it leverages strategic partnerships with the world’s largest wafer foundries TSMC and UMC. This enables its customers to take advantage of the fully integrated front and backend semiconductor manufacturing services offered in Taiwan.
    

Table 5. ASE's Products and Services as of October, 2004

ASE operates a number of testing and packaging facilities in Taiwan, Malaysia, South Korea, Japan, Singapore, China, Hong Kong, and the United States. Its facilities provide various types or levels of services with respects to different end-product focus, customers, technologies, and geographic locations.

ASE has sales offices in the United States, Europe, Asia Pacific, and Japan. 

OSE

Established in 1971, OSE has been committed to providing a broad range of high value-added IC packaging and testing services and Electronics Manufacturing Services (EMS/CEM), enabling customers to maximize and optimize their resources and apply their core strengths in research and development (R&D), design, and marketing.

   
OSE draws on its core competence in the innovation of the manufacturing process, information technology, and business workflow to offer a wide range of services to large international corporations. We pay special attention to quality control, cost structure, production capacity, timely delivery, and global logistics. By providing quality services, OSE seeks to establish long-term partnerships with its clients.
   

Understanding the demands of the future, OSE combines 30 years' experience with unrivalled research and development resources to deliver the latest high performance solutions to customers across the globe. From lead frame IC assembly and test, through to advanced Flip Chip and CSP technologies, OSE is clearly the market leading solutions provider.
   

OSE offers IC package design and fabricates a full array of packages, with pin counts from 8 to more than 830. It also offers comprehensive IC testing capabilities that verify function availability of product for customers.

Table 6. OSE's Assembly Products and Services as of October, 2004

OSE's Testing Services
  

Besides a variety of packaging services, OSE also offers comprehensive IC testing capabilities that verify function availability of logic, memory, analog, mixed signal and RF devices for customers.
 
Established in 1971, OSE began providing testing service to customers as early as 1975. OSE testing services include wafer probe, function test, test program development, loadboard design and burn-in, etc. The 256,200 sq. ft. new testing building will start operation in 2002. This facility will expand testing capacity to 7 times, its present value in terms of floor space. Combined with more than 100 experienced testing engineers and 130 testing systems, OSE is fully capable of being your testing foundry. The prominent turn-key service from OSE will shorten cycle time in the back-end process to provide its customers with a high quality and fully-functional product.
    

SPEL

SPEL Semiconductor Limited is the leading one-stop turnkey Wafer Sort, IC Assembly & Test subcon facility in India. Established in 1988 and headquartered in Chennai, SPEL had been serving the local market from 1988 to 1994. Having established a track record at home, SPEL turned its attention to the more demanding global market in 1995. It has since been exclusively serving the Silicon Valley and other parts of the world for over 9 years now. 

As a specialty, SPEL offers onsite & offshore Test Engineering support to Customers. SPEL ensures better interaction & services to Customers through a Sales & Technical support office based at Santa Clara, USA.

The 3C's - Competence, Cost-Effective and Convenience - are the guiding philosophy and building blocks on which SPEL was built and is continuing to grow.

SPEL is highly cost-effective owing to the tax-free income permitted by the Government of India and the abundant availability of well-qualified personnel at economical costs.

Table 7. SPEL's Assembly Facility as of October, 2004

Table 8. SPEL's Test Facility as of October, 2004

STATS

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