Soft Errors
from Alpha Particles
Alpha Particle-Induced Soft Errors,
or simply soft errors,
refer to transient errors in the operation of a dynamic random access
memory (DRAM) device caused by alpha
particles emitted by traces of
radioactive elements
(such as thorium and uranium) present in the packaging materials of the
device. These alpha particles manage to penetrate the die and
generate a high density of holes
and electrons
in its substrate, which creates an imbalance in the device's electrical
potential distribution that causes stored data to be corrupted.
The
alpha particles emitted by the device package can have energies of up to
8 MeV. It takes about
3.6 eV to generate an electron-hole pair in the
substrate, so an 8 MeV alpha particle can generate 2.5 million
electron-hole pairs within 2-3 microns of the alpha particle track.
The potential well of a
memory cell that contains a '0' is filled with electrons (inversion
mode), while that of a memory cell that contains a '1' is devoid of
electrons (depletion mode). When an alpha particle hits the
substrate and generates holes and electrons, the holes will be pulled
toward the substrate supply while the electrons will be pulled towards
the potential well. An empty well can
fill up with enough
electrons (assuming that enough electron-hole pairs were generated by
the alpha particle) to have its stored information
reversed
from '1' to '0'. Cells that already have electron-filled wells in
the first place are not affected by alpha particles.
The
corruption of stored information due to alpha particles is what's known
as an alpha-induced 'soft error'. Soft errors are
random
and
non-recurring.
The soft error rate depends on circuit sensitivity and the alpha flux
emitted by the package of the device. A
single
alpha particle that
possesses enough energy can cause a soft error all by itself.
The amount of charge needed to corrupt
stored information and result in a 'soft' error is referred to as the
critical charge, or
Qcrit. Qcrit becomes smaller as devices are reduced
in size and operating voltages, making soft errors a bigger problem for
smaller devices. Qcrit is also a function of the stored charge in
the memory cell.
Soft error rates due to alpha particles may be
minimized
by: 1) reducing the number of alpha particles emitted by the package; 2)
coating the chip surface with a film (such as polyimide resin) that
blocks alpha particle irradiation; and 3) better design of the memory
device to make it less sensitive to alpha-induced soft errors.
Table 1 presents some typical alpha
flux data from various package materials.
Table 1. Typical Alpha Flux from Package Materials
Package |
Package Feature |
Alpha Flux (a/cm2 x h) |
Ceramic Package |
Ceramic Body |
0.4 |
Ceramic Package |
Ceramic Base and Cap |
0.4 |
Ceramic Package |
Seal Glass |
~3 |
Ceramic Package |
Metal Leads |
<0.1 |
Plastic Package |
Plastic Body |
0.1 |
See Also:
Failure Analysis;
Die
Failures; DRAM
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