Semiconductor Photo Gallery
Mechanically Damaged Wire
Figure 1.
An Al wire that has been mechanically damaged during wirebonding
Figure
1 shows SEM photos of an aluminum (Al) bonding wire that exhibits
symptoms of having been abrasively
damaged during wirebonding. Mechanical damage such as this can be
due to the accumulation of debris in the wire
clamp of the bonder. Note that this type of damage looks similar
to corrosion damage, except that it exhibits no corrosion byproducts.
Since this
damage is mechanical in nature, chemical analysis techniques such as EDX
analysis will not register any foreign elements in the damaged areas of
the aluminum wire. For instance, if EDX analysis is done on the sample,
only Al and O will most likely show up in the EDX spectrum. The absence
of corrosive elements in the EDX spectrum of the wire will then support the
hypothesis that the damage is mechanical rather than chemical in nature.
See Also:
Wirebonding;
Bonding Failures
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