Semiconductor Photo Gallery

Ceramic Package Chip-out

Figure 1. Ceramic Package Chip-out

Figure 1 shows a SEM photo of a ceramic package (Cerdip) that has a chip-out on one side of its base. Needless to say, this is a very gross case of ceramic chip-out, given its enormous size. Chip-outs such as this can be due to large impact stresses caused by mishandling or improper packing and transport of the units.

See Also:  Package Failures; Ceramic Package Cracking

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