Common Molding-related Failure Mechanisms:

   

Package cracking - occurrence of fracture anywhere in the package

      

 

Package stress-related electrical failure - non-conformance to electrical specifications due to component degradation caused by stresses on the die surface 

  

Wiresweeping - swaying or movement of the wires during molding along the direction of mold flow which may result in broken wires or wire shorting

   

Package Voids and Pits - imperfections on the package surface (pits) or body (voids) characterized by vacancies of plastic material

  

Incomplete Filling - insufficient encapsulation resulting when the molding compound fails to fill up the cavity during molding

   

Blistering - appearance of blisters on the package surface

   

Package Delamination - any disbonding between the molding compound and another material of the package 

   

Excessive Flashes - presence of unacceptable amounts of  plastic on the edges of the package after molding

   

Solder Voids - exposure of any part of the lead base metal resulting when excess flashes that covered the leads during leadfinish are removed

     

Mark Permanence Failure - inability of the entirety of an ink  mark to remain on the package

   

Front-End Assembly Links:  Wafer Backgrind Die Preparation Die Attach Wirebonding Die Overcoat

Back-End Assembly Links:  Molding Sealing Marking DTFS Leadfinish          

 

See Also:  IC ManufacturingAssembly Equipment

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