Wafer Backgrind is the process of grinding the
backside of the wafer to the correct wafer thickness prior to
assembly. It is also referred to as
'wafer thinning.' Wafer backgrinding has not always been necessary,
but the drive to make packages thinner and thinner has made it
Most package types in the
semiconductor industry today would require a wafer thickness ranging
from 8 mils to 20 mils.
normally undergo a cleaning and surface lamination process prior to the
actual backgrinding process. Surface lamination involves the application of a
tape over the surface of the wafer to protect it from mechanical damage
and contamination during backgrinding.
surface-laminated wafers are then loaded into
cassettes that will go
into the cassette holder of the backgrinding machine.
The machine picks up the wafer from its backside (untaped side)
with a robotic arm, which positions the wafer for backgrinding.
The backgrinding process is automatically accomplished by a
wheel, following a precise set of parameters to ensure proper backgrinding.
debris from the wafer while backgrinding, the wafer is usually
continuously with D/I water while undergoing backgrinding.
Once the wafer has been background, the wafer is returned to the
cassette, and the cycle is repeated for the next wafer.
set for backgrinding include spindle speed, spindle coolant water
temperature and flow rate, D/I water temperature, initial and final
wafer thickness, and feed speeds.
Backgrind Failure Mechanisms
Photos of Backgrind Systems
Backgrind Failure Mechanisms;
Manufacturing; Assembly Equipment
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