a more complete list of standards, pls see http:www.jedec.org
IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION
FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES
This document identifies the classification
level of nonhermetic solid-state surface mount devices (SMDs) that
are sensitive to moisture-induced stress. It is used to determine
what classification level should be used for initial reliability
qualification. Once identified, the SMDs can be properly packaged,
stored and handled to avoid subsequent thermal and mechanical damage
during the assembly solder reflow attachment and/or repair
operation. This revision now covers components to be processed at
higher temperatures for lead-free assembly.
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE
OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES
This document provides SMD manufacturers
and users with standardized methods for handling, packing, shipping
and use of moisture/reflow sensitive SMDs. Now updated to support
components that may need to be processed at higher temperatures,
such as lead-free processes, these methods help avoid damage from
moisture absorption and exposure to solder reflow temperatures that
can result in yield and reliability degradation. IPC/JEDEC
J-STD-033A helps achieve safe and damage-free reflow with the dry
packing process and provides a minimum shelf life of 12 months from
the seal date when using sealed dry bags.
JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR
NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS
This standard defines the procedures for
performing acoustic microscopy on non-hermetic encapsulated
electronic components. This method provides users with an acoustic
microscopy process reflow for detecting defects non-destructively in
plastic packages while achieving reproducibility.
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and
This document defines
a standard test method for
evaluating the solderability of the leads or interconnect features of
components, as well as lugs, terminals, wires, and other forms of
terminations. Solderability is defined as
the ability of the termination to form a uniform, smooth, unbroken,
film of solder on its surface with
excellent adhesion properties.
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CYCLED TEMPERATURE HUMIDITY BIAS LIFE
pertains to the Cycled Temperature-Humidity-Bias Life
Test, which is performed to evaluate the reliability of non-hermetically packaged solid state devices in humid environments. It
employs conditions of temperature cycling, humidity, and bias that
accelerate the penetration of moisture through the external
protective material (encapsulant or seal) or along the interface
between the external protective material and the metallic conductors
that pass through it.
STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE
establishes a defined method for performing a temperature
humidity life test with bias applied. The test is used to evaluate the
reliability of non-hermetically packaged solid state devices in humid
environments. It employs high temperature and humidity conditions to
accelerate the penetration of moisture through external protective
material or along interfaces between the external protective coating and
conductors or other features which pass through it.
MOISTURE RESISTANCE - UNBIASED AUTOCLAVE
pertains to the Unbiased Autoclave Test, which is performed to
evaluate the moisture resistance of non-hermetically packaged solid state
devices. It is a highly accelerated test which employs conditions of
pressure, humidity and temperature under condensing conditions to
accelerate moisture penetration through the external protective material (encapsulant
or seal) of the package or along the interface between the external
protective material and the metallic conductors passing through it.
provides a method for determining solid state devices' capability to
withstand exposure to alternating cycles of extremely high and extremely
low temperatures. The worst-case load temperature must reach the specific
extremes to ensure proper sample stressing regardless of chamber loading. Definitions
are provided for Load, Monitoring Sensor, Worst-Case Load Temperature, and
POWER AND TEMPERATURE
establishes a method for determining the ability of a device to withstand
exposure to alternating cycles
of extremely high and extremely low temperatures, with operating biases
periodically applied and removed. This test method is considered
destructive, and is intended primarily for device qualification.
defines the requirements of Thermal Shock testing, which is conducted to
determine the resistance of a part to exposure to sudden and extreme
changes in temperature, as well as its resistance to the alternating
exposures to extremely high and low temperatures.
defines a method for
determining the resistance of solid state devices against corrosion as a result
of exposure to a saline atmosphere.
TEMPERATURE, BIAS, AND OPERATING
defines a method for determining the
effects of bias conditions and temperature on the operating life of solid
- HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY STRESS TEST (HAST)
defines a standard method for performing HAST, which
evaluates the reliability of non-hermetically packaged solid state
devices exposed to humid environments, particularly their resistance to
internal corrosion. It employs severe conditions of temperature, humidity,
and bias that accelerate the penetration of moisture into the package and
OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
establishes an industry-standard preconditioning procedure for plastic SMDs (surface mount devices),
which is intended to simulate a typical board-mounting process with multiple reflow operations. Plastic SMDs
should be subjected to the appropriate preconditioning sequence of this
document by the semiconductor manufacturer prior to being submitted to
specific in-house reliability testing (qualification and reliability
monitoring) to evaluate long term reliability.
DISCHARGE (ESD) SENSITIVITY TESTING HUMAN BODY MODEL (HBM)
defines a standard method for testing and classifying microcircuits
according to their susceptibility to damage or degradation by exposure to Human Body Model (HBM) electrostatic discharge
(ESD). The objective is to provide reliable, repeatable HBM ESD test
results so that accurate classifications can be performed.
DISCHARGE (ESD) SENSITIVITY TESTING MACHINE MODEL (MM)
This document defines
a standard method for testing and classifying microcircuits
according to their susceptibility to damage or degradation by exposure to
Machine Model (MM) electrostatic discharge (ESD). The objective
is to provide reliable, repeatable MM ESD test results so that accurate
classifications can be performed.
CHARGED-DEVICE MODEL TEST METHOD FOR ELECTROSTATIC DISCHARGE WITHSTAND
THRESHOLDS OF MICROELECTRONIC COMPONENTS
a standard method for
classifying microcircuits according to their susceptibility to damage or
degradation by exposure to Charged Device Model (CDM) electrostatic
discharge (ESD). The charged device model simulates device
charging/discharging events that occur in production equipment and
PHYSICAL DIMENSION TESTS
provides a method for determining whether the external physical dimensions
of the device are in accordance with the applicable procurement document.
EXTERNAL VISUAL INSPECTION
pertains to external visual inspection, the purpose of which is to verify that the materials, design, construction,
markings, and workmanship of the device are in accordance with the
applicable procurement document. External visual is a nondestructive test
and applicable for all package types. The test is useful for
qualification, process monitor, or lot acceptance.
defines a standard test method for determining the solderability of
device package terminations that are intended to be joined to another
surface using solder for the attachment. It also provides optional
conditions for aging and soldering for the purpose of allowing simulation
of the soldering process to be used in the device applications. It
provides procedures for dip and look solderability testing of through
hole, axial and surface mount devices and simulated reflow testing for
surface mount packages.
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VARIABLE FREQUENCY TESTING
pertains to the Vibration,
Variable Frequency Test Method, which is intended to determine the ability of component(s) to withstand moderate to severe vibration as a result of
motion produced by transportation or filed operation of electrical
equipment. This is a destructive test that is intended for component
defines a standard test for determining the suitability of component parts for use in
electronic equipment that may be subjected to moderately severe shocks as
a result of suddenly applied forces or abrupt changes in motion produced
by rough handling, transportation, or field operation. This is a destructive test intended for device
qualification, and is normally applicable to cavity-type packages.
This standard provides various tests for determining the integrity
interfaces and the lead itself when the lead(s) are bent due to faulty
board assembly followed by rework of the part for reassembly. For hermetic
packages it is recommended that this test be followed by hermeticity tests
in accordance with Test Method A109 to determine if there are any adverse
effects from the stresses applied to the seals as well as to the leads.
This test, including each of its test conditions, is considered
destructive and is only recommended for qualification testing. This test
is applicable to all through-hole devices and surface-mount devices
requiring lead forming by the user.
SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
establishes a standard procedure for determining whether through-hole
solid state devices can withstand the effects of the high temperature to which
they will be subjected during the soldering of their leads.
TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICES
defines a standard test for measuring the deviation of the terminals
(leads or solder balls) of surface-mount semiconductor devices from perfect coplanarity.
TENSILE PULL TEST
pertains to the Flip Chip
Tensile Pull Test Method, which is performed to determine the fracture mode and
strength of the solder bump interconnection between the flip chip die and
the substrate. It should be used to assess the quality and consistency of the chip-substrate
joining process. This test method is a destructive test.
WIRE BOND SHEAR
This document establishes a standard procedure for determining the strength of an
integrated circuit's wire bond by shearing the bond from the surface it is
attached to and measuring the force required to accomplish it. This method serves as an
alternative to pulling the wire vertically until the wire separates from
one of it's two bonded surfaces. It also provides guidelines for
determining an appropriate minimum shear force for gold balls on aluminum
alloy bonding surfaces.
BALL GRID ARRAY
(BGA) BALL SHEAR
defines a standard BGA Ball Shear Test method. It defines the terms
related to ball shear testing;
describes the BGA ball shear test apparatus and procedure; and identifies
the BGA ball shear failure modes and their criteria.
LINKS to JEDEC SPECS:
<Reliability Testing: THB, Autoclave, Temp Cycle, Thermal
<Reliability Testing: Precon, HAST, Salt
Atmosphere, Operating Life, ESD>
<Package Testing: Visual, Solderability,
Mechanical, Lead Integrity>
<Package Testing: RTSH, Coplanarity, Flip Chip
Pull, WB/Solder Ball Shear>
Engineering; MIL-STD-883 Methods; IPC/JEDEC MSL's;
All Rights Reserved.