MIL-STD-883 Standard Test Methods   


Method No.

Name of Method


Equipment Needed


Moisture Resistance Test

To evaluate in an accelerated manner the resistance of component parts and constituents to the effects of high-humidity and heat conditions

Uses temperature/humidity chambers capable of cycling conditions


Steady-State Life Test

To determine the reliability of devices subjected to specified conditions (standard: 125 deg C with steady-state bias) over an extended period of time (standard: 1000 hours minimum)

Uses a controlled temperature chamber/oven, power supplies, measuring devices


Intermittent Life Test

To determine the reliability of devices subjected to specified conditions that involve cyclical "on-off" variations in electrical stresses

Same as Method 1005 but electrical excitation must be dynamic


Stabilization Bake

To determine the effect of storage at elevated temperatures without electrical stress applied

Uses a controlled temperature chamber/oven


Salt Atmosphere Test

To serve as an accelerated laboratory corrosion test simulating the effects of seacoast atmosphere

Uses a salt atmosphere chamber


Temperature Cycling

To determine the resistance of a part to extremes of high and low temperatures

Uses a temp cycling chamber capable of providing and controlling  temperatures


Thermal Shock

To determine the resistance of the part to sudden exposures to extreme changes in temperature and alternate exposures to these extremes

Uses thermal shock equipment capable of providing and controlling specified temperatures


Thermal Characteristics Tests

To determine the thermal characteristics of devices: junction temperature, thermal resistance, case and mounting temperatures, thermal response time, etc.

Uses a controlled temperature chamber, thermocouples, electrical measurement equipment, IR microradiometer, etc.


Dew Point Test

To detect the presence of moisture trapped inside a device package that may affect device parameters, i.e., leakage current

Uses an equipment that can expose the device to the specified high temp down to -65 deg C while measuring affected parameters


Hermeticity Tests

To determine the hermeticity of the seal of devices with internal cavities

Uses a fine leak tester and a gross leak tester


Burn-in Test

To eliminate units with marginal defects that can result in early life failures

Uses a burn-in oven capable of providing high temperature (100-250 deg C) and electrical stress


Life/Reliability Characterization Tests

To determine life distributions, life acceleration characteristics, and failure rate potential of devices

Uses a burn-in oven capable of providing high temperature (200-300 deg C) and electrical stress


Internal Water Vapor Content Test

To measure the water vapor content of the atmosphere inside a hermetically-sealed device

Uses a mass spectrometer or moisture sensor, vacuum chamber, and a piercing system


Method No.

Name of Method


Equipment Needed


Constant Acceleration

To determine the effects of constant acceleration on microelectronic devices

Uses an apparatus that can apply specified acceleration for the required time


Mechanical Shock

To determine the suitability of devices for use in equipment subjected to moderately severe shocks

Uses an apparatus capable of providing shock pulses of 500 to 30000 g for 0.1 to 1 ms


Solderability Test

To evaluate the solderability of terminations joined by soldering

Uses a solder pot, a dipping mechanism, and a steam ager


Lead Integrity Test

To determine the integrity of microelectronic device leads, welds, and seals

Requires clamps and fixtures to secure the device and attaching weights to the leads



Vibration Tests (fatigue/variable frequency)

To determine the effect of vibration on components in the specified frequency range

Uses equipment capable of providing the required vibration at the specified levels


External Visual Inspection

To verify the workmanship of hermetically packaged devices

Uses optical inspection equip- ment capable of 1.5X-10X mag


Internal Visual Inspection

To check the internal materials, construction, and workmanship of microcircuits

Uses optical inspection equipment capable of the specified magnification


Bond Strength Test

To measure bond strengths and evaluate bond strength distributions

Uses equipment capable of applying the specified stress to the bond, lead wire, or terminal


Resistance to Solvents Test

To verify that the markings will not become illegible when the part is subjected to solvents

Uses a vessel made of inert material and of sufficient size to permit complete immersion of specimens in solvents


Physical Dimensions Test

To verify that the external physical dimensions of the device meet the requirements

Uses micrometers, calipers, gauges, contour projectors, etc.


Die Shear Strength Test

To determine the integrity of materials and procedures used to attach semiconductor die 

Uses a load-applying instrument with an accuracy of +/-5% of full scale or 50 grams



To detect loose particles inside a device cavity

Uses a Particle Impact Noise Detection (PIND) System


Glassivation Layer Integrity Test

To assess the structural quality of deposited dielectric films or glassivation over the die

Uses a suitable sample handling equipment chemical etching facilities 


Lid Torque Test

To determine the shear strength of the seal of glass-frit-sealed packages

Uses an equipment that applies torque to the seal of the sample


Adhesion of Lead Finish Test

To determine the integrity of all primary and undercoat lead finishes

Uses suitable clamps and fixtures for bending stresses to the lead at specified angles


See Also:  Mil QCI Group Tests;  Mil-PRF-38535 Reliability Engineering;  





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