EESemi.com Forum Archives
EDX Analysis of Bond Pad
Contaminants
Bond
lifting cases are commonly caused by the presence of contaminants on
the bond pads.
Thus, investigation of bond lifting issues usually includes a step for
determining whether the bonding pads are contaminated or not. One FA
technique often used in analyzing bond pad contamination is
EDX analysis. The archived forum
thread below discusses how EDX analysis is used in the analysis of bond
pad contamination.
Posted by Seinfeld:
Wed Jul 30, 2003 1:24 pm
Post subject: Contam on Bond Pad |
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We're experiencing ball lift
issues and we think the bond pads of our lots are
contaminated. But visual inspection using the microscope
showed that the pads are clean. Is it still possible
that the pads are contaminated? What tests do you
recommend for us to check this?
Seinfeld |
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Posted by Memsy: Wed
Jul 30, 2003 6:46 pm Post
subject: |
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Try EDX analysis.
_________________
I you can't do it, don't! |
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Posted by EE: Thu Jul
31, 2003 10:08 am Post
subject: |
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Hi Seinfeld,
At the correct EHT level during EDX analysis, the EDX
spectrum will only register Al if the bond pad is clean.
Given that your bond pads do not exhibit any visual
anomalies, the contam may be in the form of a very thin
layer of unetched glass. This would register as a peak
of Si in the EDX spectrum.
Note, however, that Si may also register in the spectrum
of a clean bond pad if the EHT used is too high. This is
because the silicon under the aluminum bond pad is now
being detected by EDX. Thus, if you see both Al and Si
in your first spectrum, you must get another spectrum to
verify if the SI is above or below the aluminum layer.
If it’s really unetched glass that’s on your bond pad,
you will see Si and Al at a very low EHT, then see Al
rising relative to Si as you increase the EHT, then
eventually reach a point where the Si peak increases
more quickly relative to the Al peak as the EHT is
increased.
Needless to say, if you see S, P, K, or Cl on your bond
pads, you don’t need to get EDX spectra at different
EHT’s since you’re sure that these couldn’t have come
from below the bond pad.
Thanks and keep on posting!
EE |
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Posted by Seinfeld:
Fri Aug 01, 2003 10:35 am
Post subject: |
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We tried EDX at low EHT (5 keV)
and saw significant silicon peak and just a small
aluminum peak. We can already conclude that there's
silicon contam on top of the bond pad, right?
Seinfeld |
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Posted by FARel Engr:
Fri Aug 01, 2003 11:03 am
Post subject: |
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Yes, I think you can make that
conclusion because a bond pad should only show Al and O
at that EHT. Just a warning - using a low EHT for EDX
analysis will not generate peaks of some elements, so
you might not see all the elements present if the EHT is
low. This is why EE is suggesting other EHT levels too.
Regards,
FARel Engr |
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