EESemi.com Forum Archives
Silicon Dust from Wafer Saw
Wafer sawing during the die preparation process
can result in
the accumulation of silicon dust on the wafer if not properly done.
Silicon dust contamination of the bond pads can cause wirebonding
issues. The archived forum thread below discusses the issue of
silicon dust contamination from wafer saw.
Posted by Donnie: Sat
Mar 25, 2006 7:35 am Post
subject: Silicon dust contamination |
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Mga Sir's and Ma'ams,
May I ask for your help about our current problem in
wafer
saw. I'm just new in the process, can you please give me
some pointers??
thanks.
_________________
PACLANDER |
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Posted by FARel Engr:
Tue Mar 28, 2006 3:30 pm
Post subject: |
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Hi Donnie,
Welcome to the forum. We don't know what you already
know, which is why it's difficult to answer your
question. Anyway, just to start things off, here are my
tips to you.
1. Understand your sawing process well. By optimizing
your wafer saw process, you can minimize the amount of
particles generated during sawing. Try to check for the
history of your process. Is this the first time you had
a silicon dust issue? if not, what do the previous engg
reports tell you? Dig these up and learn from these
reports.
2. How do you clean your wafers during and after saw?
Does it involve vacuuming or wet cleaning? Is static
charge, which makes the particles stick to the wafers,
being addressed?
I'm not an Assembly guy as you can see from my alias,
but hopefully with these simple tips the Assembly guys
will come out with more sophisticated answers. Until
they do, you need to do a lot of research on the
internet on how wafer saw is done in the industry to
minimize saw dust.
BTW, have you tried consulting with the 'senior'
engineers in your org?
Good luck to you!
FARel Engr |
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Posted by Donnie: Tue
Mar 28, 2006 10:44 pm Post
subject: |
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Dear Sir,
It's kind'a funny Sir, because my Senior Engineer has
only
1 year experience in wafer saw (local Engineer) that's
why I'm
on my own. Anyway, about your questions Sir:
1. Yeah, this is the first time this case happened here
because our
assembly is only 6 months old.
2. We use wet cleaning Sir, high pressured water spray.
Thank you for your reply Sir, I very much appreciated
it.
I just hope the Experts can add more deeper answers.
_________________
PACLANDER |
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Posted by FARel Engr:
Thu Mar 30, 2006 9:21 am
Post subject: |
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Donnie,
Given that your assembly is just 6 months old, you
really need to go through the birth pains that all
established assembly houses have gone through. Be
prepared to do tons and tons of evaluations to optimize
your process. I've seen our assembly guys doing all
sorts of evaluations just to get things 'right', and
this is a continual process.
Anyway, I suggest that you : 1) conduct evaluations to
optimize your saw parameters so that the generation of
dust particles is minimized; and 2) conduct evaluations
to optimize your cleaning process. Before you design
your evaluations, do a lot of research on what
parameters are important and how such evaluations are
done. Surf the net extensively, download as many papers
as you can, and even buy documents that you think will
be useful to you. Soon you'll have tons of ideas on how
to attack your line problems. |
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Posted by FARel Engr:
Thu Mar 30, 2006 9:27 am
Post subject: |
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One more thing - before you
optimize your process, make sure first that your process
is IN CONTROL. Look at your data first and ensure that
your output parameters are consistently meeting their
specs. If your process output is jumping all over the
place, then your first order of the day is to
're-establish' your process and bring it first under
control. After that can you only optimize your process
further. |
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Posted Donnie: Fri Mar
31, 2006 7:27 am Post
subject: |
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Thank you again Sir for your
advice. yeah, I think I really have to do
a lot of research and experiments.
thanks again!!!
_________________
PACLANDER |
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