Posted by Mike: Fri Jun 10, 2005 3:22 pm    Post subject: Chip Metallization

Anybody know about metallization of wire bond pad like Al/Ti ?

Posted by Chip: Sun Jun 12, 2005 2:42 pm    Post subject:

Other kinds of die metallization:
- pure Al
- Al / 4%Cu
- Al / 2%Si
- Al / 4% Cu / 2% Si
- Al / 1.2% Si / .15% Ti
- Al / 0.1-0.5% Ti
- etc., etc.

In other words, there are many possible alternatives.

Posted by Mike: Mon Jun 13, 2005 4:56 pm    Post subject:

Thanks. Could you tell me typical thickness of metallization?

Posted by Guest: Fri Jun 17, 2005 1:46 pm    Post subject:

how about aluminum fluoride? anyone here heard of that or had encountered that problem??? and what are some metallizations that are most can be seen visually by inspection?

Posted by Guest: Tue Jul 05, 2005 4:36 pm    Post subject:

Hi Mike:
Metallizations ? You meaning the typical IMC thickness ?
Normally, It's base on gold ball shear or will pull to judge the wire bonding quality and the both of test values and defect mode is very important for this.
You can using cutter to cross-section and then to do SEM for inspection IMC layer and EDS(EDX) to measure it if you interest.
The Poor IMC also will cous hi resistance during F/T.
For your reference.

Posted by Guest: Tue Jul 08, 2005 1:14 pm    Post subject:

No, I think he means the thickness of the metal layers themselves.  Metal thicknesses used by chips vary, ranging from a few hundred angstroms to a few thousand angstroms.