The
TO-66
or TO66
is
a
type of 'metal can' package that is capable of high-power dissipation
commonly used by power transistors, SCR's and other high-power
semiconductor devices.
The TO-66 is made entirely of metal, with the microchip mounted on the
die pad of its
metal can base and then covered with a metal cap.
Using the holes at the ends of the TO-66 package base, larger heat sinks
may be screwed onto the package to increase its power handling capability. If necessary, the heat sink may be
electrically isolated from the TO-66 package using mica or ceramic
insulator pads that are inserted between the TO-66 body and the heat
sink. The TO-66 is very similar to the TO-3,
but it is smaller than the latter.
A typical power transistor packaged in
a TO-66 package has two protruding terminals (one for the base and the
other for the emitter), with the collector using the TO-66's body itself
as its terminal for direct thermal conduction to the heat sink.
Table 1. Properties of
a Typical TO-66
|
Base Size
(Length x
Width x Thickness) |
Cap
Diameter |
Cap
Height |
Lead
Length |
Lead
Pitch |
|
34 mm x
20 mm x 1.6 mm |
12.4 mm |
5.7 mm |
9.1 mm |
5 mm |
