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MLP - Micro Leadframe Package

        

The Micro Leadframe Package, or MLP, is a JEDEC-compliant, very thin, near-CSP square-shaped or rectangular surface-mount plastic package uses metal pads instead of leads for electrical connection to the outside world.  The MLP belongs to the same 'no leads' package family as the QFN and the DFN.

   

The MLP is available in three variants:  1)  Dual MLP (MLPD), 2) Quad MLP (MLPQ), and 3) Micro MLP (MLPM).  The MLPD has pads on only two sides of its package body while the MLPQ has pads all around the periphery of its package body.  MLPMs are smaller versions of the standard MLPs, with typical body sizes from 2 mm square to 3 mm square.

   

MLPs usually have exposed die attach pads to ensure good thermal conductivity when soldered onto the PCB. Typical MLP pad counts range from 8 to 64. The body thickness of MLPs typically ranges from 0.60 mm to 0.90 mm. The pad pitch (distance between pads) used by MLPs can range from 0.5 mm to 1.27 mm. 

      

Table 1. Properties of Some Examples of MLP's

Type

No. of Pads

Body Size

Body Thickness

Pad Pitch

MLPM

8

2 mm x 3 mm

0.90 mm

0.65 mm

MLPM

8

3 mm x 3 mm

0.90 mm

0.95 mm

MLPD

8

5 mm x 6 mm

0.80 mm

1.27 mm

MLPQ

20

4 mm x 4 mm

0.88 mm

0.5 mm

MLPQ

48

7 mm x 7 mm

0.90 mm

0.5 mm

MLPQ

56

8 mm x 8 mm

0.88 mm

0.5 mm

   

Figure 1.  Bottom and top views of a Dual Micro Leadframe Package (MLPD)

      

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