Semiconductor Photo Gallery

 

   

Plastic Package Chip-out

 

Figure 1. Plastic Package Chip-out

          

Figure 1 shows a SEM photo of a plastic package (SOIC) that has a chip-out on its pin 1 corner. This is a gross case of chip-out since an internal feature of the package, the pin 1 lead finger, has already been exposed. Chip-outs such as this are caused by the application of excessive mechanical stress on the package, usually during the post-mold assembly steps, i.e., deflash, trim, form, and singulation (DTFS).

   

See Also:  Package Failures; Package Cracking

      

Back to Semiconductor Photo Gallery

       

HOME

 
 

Copyright 2006 EESemi.com. All Rights Reserved.