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detachment of the die from the die pad or cavity.
contamination on the die pad or cavity, die backside contamination,
excessive die attach voids, incomplete die attach coverage,
inadequate die attach curing
- occurrence of fracture anywhere in the die.
context of Die Attach:
excessive die attach voids, die overhang or
insufficient die attach coverage, insufficient bond line thickness, excessive die ejection force on
the wafer tape
, absence of die attach voids
electrical shorting between exposed metal lines, bond pads, bonds,
or wires as a result of adhesive accidentally dripping on the
surface of the die (sometimes called 'epoxy on die').
incorrect die attach material viscosity, incorrect adhesive
- lifting of the first or second bond from the die
or leadfinger, respectively. From the die attach process point of
view, this is often due to resin bleeding of the die attach material
into the bond pads or leadfingers, inhibiting good intermetallic
formation. See also
- inducement of any mechanical damage on the
die, as when an operator scratches a die with tweezers due to
insufficient operator training, worn-out or contaminated
pick-and-place tool, disorderly workplace, use of improper tools
depression or deformation of any metal line on the die surface.
dirty or worn-out die attach pick-and-place tool, wafer mishandling
Die Shear Testing; Die
Attach Tools; Die
Manufacturing; Assembly Equipment
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