IC Packaging /
Assembly Equipment Accessories and Tools
packaging/assembly equipment will not be able to do their functions without the
various accessories and toolings that complement them.
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Wafer saw equipment use
blades to cut wafers
into individual dice. Wafer
are used to support the wafer tape, one side of which is a sticky
surface that holds the wafer during sawing.
Die attach equipment use
various die attach tools
to mount the die on the die pad. They use
to eject every sawn die from the wafer tape, while tools known as
die attach collets
or pick-up tools
are used to pick the dice by vacuum and to position them for mounting on the die pad
or cavity. The epoxy on the die pad and substrate are deposited by
epoxy dispensing tools
or epoxy stamping
Wirebonding equipment use
axial-symmetric ceramic tools called
for thermosonic ball bonding. For wedge bonding, wedge-shaped
tools called, well,
wedges' are used.
Wedges are normally composed of tungsten carbide or titanium carbide.
Capillaries have vertical feed holes (holes where the bonding wires
enter) while wedges have angled feed holes at the bottom. See
for more details.
Mold presses must be
in order to perform its plastic encapsulation function. The main parts of a
mold die are its mold
DTFS equipment use a wide
assortment of blades, punches, anvils, inserts, and other precisely
toolings for their
cutting and punching functions.
The pad printing process
used for ink marking uses a
made of silicone rubber to mark the package. This stamp pad in turn gets
its ink patterns from an
that contains depressions filled with ink.
Die Attach Tools; Wirebonding Tools;
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